OrbitIO interconnect designer capabilities deliver hierarchical multi-substrate-optimized design for SoCs and ASICs across IC package/SiP and systems SAN JOSE, Calif., May. 04, 2016 – Cadence Design ...

Advanced packaging techniques are viewed as either a replacement for Moore’s Law scaling, or a way of augmenting it. But there is a big gap between the extensive work done to prove these devices can ...

Packaging often stands as the first physical point of contact between a brand and its audience. While often overlooked or treated as an afterthought, package design reflects a brand’s attention to ...

The megatrend in electronic design today is end-to-end collaboration across ICs, packaging, PCBs, systems, data centers, and ...

Digital twins dominated discussions at SEMICON West this year, appearing in keynote presentations, panel sessions, and workshops. The conversation reflected a noticeable shift in how the industry ...

Consumers do make snap judgements based on what they’re looking at. They look at a product, and its packaging says something to them. Packaging is eye-catching and inviting, and it’s critical for ...

What do you think packaging design will look like in 2024? In the next year, packaging design will continue to evolve and surpass the limitations imposed by traditional shelf-space categories. With ...

Dezeen Competitions: The Salmon Packaging Design Competition tasks designers with creating innovative packaging using corrugated cardboard sourced from sustainable and renewable materials. The ...