IBM's NanoStack architecture has led to transistors that deliver 50% better performance and 70% less energy versus today's ...

Piling on guardrails is the sign of a system permanently compensating for its own unreliability. There’s a better approach. According to Sonar’s State of Code Developer Survey report for 2026, based ...

Researchers at Cornell University, in collaboration with industry giants TSMC and ASM, have developed a high-resolution 3D imaging technique that can detect atomic-scale defects in computer chips.

This image shows the silicon, silicon dioxide, and hafnium oxide layers inside a transistor channel. Credit: Cornell University A stunning new imaging breakthrough lets scientists see — and fix — the ...

Seoul National University's College of Engineering announced that a research team led by Professor Chul-Ho Lee from the Department of Electrical and Computer Engineering has outlined a comprehensive ...

Electrical and Computer Engineering, Purdue University, West Lafayette, Indiana 47907, United States Birck Nanotechnology Center, Purdue University, West Lafayette, Indiana 47907, United States ...

Posts from this topic will be added to your daily email digest and your homepage feed. The US wants to bring back domestic chipmaking. But America’s first generation of Silicon Valley factory workers ...

China’s wind power generation is rich in resources and mature technology, but has the problems of harsh power generation environment, high operation and maintenance costs due to complex operating ...

Abstract: Aircraft skin defect detection is one of the crucial steps in the regular maintenance. However, the performance of defect detection algorithms is limited by insufficient data, which makes a ...

Abstract: To solve the problem of scarcity of bolt defect samples in transmission lines, we propose a bolt defect image generation method based on dual discriminator architecture and ...

Quantum materials are of fundamental interest and are promising for applications such as next-generation computers. These materials are commonly studied with bulk averaging probes and thus their ...

The problem of surface defect detection problem is important for quality control in electronics manufacturing. This problem has several characteristics. First, a real-time inference speed is required.